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From July 1st, 2024, GradConn & GCT (both Aloco Group companies) will merge under the GCT brand. The planned completion date is Q1 2025.
All current GradConn products will remain available under their existing part codes for the foreseeable future. Please contact us if you need to re-order.
Please use one of the links below to continue your journey.
Following the merger with GCT your choice of Board-to-Board connectors is now even wider.
GradConn B2B connectors will remain available under the same part code for existing projects. Please contact us if you need to re-order.
Following the merger with GCT your choice of SIM connectors is now even wider.
GradConn SIM connectors will remain available under the same part code for existing projects. Please contact us if you need to re-order.
The images below shows examples of how customers might use GradConn's board to board elevated headers to connect PCB's in parallel stacking applications.
This is a basic building block of board to board connector design. From the left, the first image shows a thru hole stacking header hard soldered into two PCB's.
The next image shows a thru hole elevated header passing thru a mid PCB and going onto connect with a thru hole socket on the top PCB.
The final image shows an SMT socket on the bottom board, a stacking thru hole header and pass thru application, and a thru hole socket on the top PCB.
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