GradConn and GCT Merge

From July 1st, 2024, GradConn & GCT (both Aloco Group companies) will merge under the GCT brand. The planned completion date is Q1 2025.

All current GradConn products will remain available under their existing part codes for the foreseeable future. Please contact us if you need to re-order.

Please use one of the links below to continue your journey.

Contact a member of the GradConn team. Remain on the GradConn site (for information only)

Even More Choice

Following the merger with GCT your choice of Board-to-Board connectors is now even wider.

GradConn B2B connectors will remain available under the same part code for existing projects. Please contact us if you need to re-order.

Even More Choice

Following the merger with GCT your choice of SIM connectors is now even wider.

GradConn SIM connectors will remain available under the same part code for existing projects. Please contact us if you need to re-order.

From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.
From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.
From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.
From July 1st 2024 GradConn has merged with GCT. To find out how this may affect your purchases please click here.

Header Pin Plating and Materials

This page shows the basics of materials and plating for board to board pin headers.

View all Board to Board Connectors

gradconn-board-to-board-pin-plating-and-materials

Base material

Base pins are produced from either brass or phosphor bronze.

Brass

Lowest cost.
Good spring properties and strength.
Reasonably good conductor.

Phosphor Bronze

Good strength and conductivity.
Superior elasticity.
Excellent fatigue resistance.

Plating

Base pins are underplated with nickel and a finish plating added for improved conductivity, high temperature protection and resistance to corrosion and wear. Finish plating is available in variants of gold or tin.

Gold

Excellent corrosion resistance and durability.
Excellent conductivity and low electrical resistance.
Various thicknesses available.

Tin

Excellent solderability and conductivity.
Lower cost.
Available in bright or matte.

Selective

Gold in contact area, tin in solder area.
Tin provides best solderabily in PCB area.
Gold provides best conductivity in mating area.

See GradConn's whole range of board to board connectors here.

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