GradConn and GCT Merge

From July 1st, 2024, GradConn & GCT (both Aloco Group companies) will merge under the GCT brand. The planned completion date is Q1 2025.

All current GradConn products will remain available under their existing part codes for the foreseeable future. Please contact us if you need to re-order.

Please use one of the links below to continue your journey.

Even More Choice

Following the merger with GCT your choice of Board-to-Board connectors is now even wider.

GradConn B2B connectors will remain available under the same part code for existing projects. Please contact us as GCT if you need to re-order.

Even More Choice

Following the merger with GCT your choice of SIM connectors is now even wider.

GradConn SIM connectors will remain available under the same part code for existing projects. Please contact us as GCT if you need to re-order.

It's Nearly Time For Us To Go

Now that GradConn has fully merged with GCT, the most up-to-date information about our products and releases can be found on the GCT Website.

The GradConn website will remain available for information and contact purposes until Q4 2025.

For any queries or concerns relating to the GradConn website, please Contact Us.

GCT and GradConn have concluded a merger under the GCT brand. Read more here
News Release - 2012-08-01

Beyond Components and GradConn agree deal to distribute interconnect products in North America

beyond
Interconnect specialist GradConn and distributor Beyond Components have signed a nationwide distribution agreement. Beyond will promote all GradConn connectors, including an extensive Board-to-board range, SIM connectors, Micro USB2.0 connectors and Coaxial cable assemblies.

Commenting on the agreement, Andrew Stewart, GradConn Sales Manager said "We are excited to be working with Beyond, their national reach brings a substantially more sophisticated and capable supply chain for North American customers to access GradConn products, coupled with their depth of interconnect technical expertise and customer engagement we feel this is a winning deal".

Lou Dinkle Beyond Components' CEO said "Having signed on GradConn expands our existing inventory of board-to-board connectors and adds Micro USB and SIM/Wireless technology to our product line-up. We are now able to offer our customers an even greater variety of technologies and cutting edge products which makes Beyond and GradConn a good fit".

Click here to find a Beyond Components office in your location.

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