News Release - 2012-08-01

Beyond Components and GradConn agree deal to distribute interconnect products in North America

Interconnect specialist GradConn and distributor Beyond Components have signed a nationwide distribution agreement. Beyond will promote all GradConn connectors, including an extensive Board-to-board range, SIM connectors, Micro USB2.0 connectors and Coaxial cable assemblies.

Commenting on the agreement, Andrew Stewart, GradConn Sales Manager said "We are excited to be working with Beyond, their national reach brings a substantially more sophisticated and capable supply chain for North American customers to access GradConn products, coupled with their depth of interconnect technical expertise and customer engagement we feel this is a winning deal".

Lou Dinkle Beyond Components' CEO said "Having signed on GradConn expands our existing inventory of board-to-board connectors and adds Micro USB and SIM/Wireless technology to our product line-up. We are now able to offer our customers an even greater variety of technologies and cutting edge products which makes Beyond and GradConn a good fit".

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